Manufacturing
Printed Circuit Board Assembly and Test
Test Services
Electromechanical Assembly and System
Integration
Cables
Printed Circuit Board Assembly and Test
Manufacturing Core Competency
Tooh
Dineh Industries specializes in low to medium volume, high mix
printed circuit board assembly, electro-mechanical assembly, complete
system
level manufacturing, and testing. To ensure the highest quality
products are manufactured in our 55,000 sq. ft. facility, we maintain
strict environmental
controls.
All of our staff receives thorough ESD training and is required
to comply with ISO-certified monitoring procedures. All manufacturing
operations are performed by IPC certified operators.

Printed Circuit Board Assembly
Surface
Mount Assembly
TDII has three independent Fuji component placement lines. Each
line is capable of state of the art placement of fine pitch mixed
technology and ball grid array components.
Plated Through Hole Assembly
TDII uses both automated equipment and manual assembly processes.
We have two wave solder machines.
SMT Equipment
- MPM printers
- Fuji CP6 high speed chip shooters
- Fuji IP3 odd form placement
- Conceptronics HVA102 reflow ovens
- FujiCam equipment management software
- Mantis inspection scopes
- Glenbrook X-ray station
- Metcal BGA rework station
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Technology Capabilities
- Plastic / Ceramics BGA / Micro BGA
- Ultra fine pitch QFPs
- 0201 SMT devices
- FR4 PCB
- Rigid flex PCB
- CSP
Special Processes
- PCB conformal coating capabilities
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Through Hole Equipment
- Royonics semi-auto component placement
- Lead trimming
- Connector placement tools
- Electrovert wave solder
- Depanelizing
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